ED Copper Foils for FPC

ED Copper Foils for FPC

FCF, flexible copper foil is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.
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Description
Technical Parameters

Civen Metal Material (Shanghai) Co., Ltd. is one of the leading manufacturers and suppliers of ed copper foils for fpc in China. Welcome to buy bulk durable ed copper foils for fpc made in China here from our factory. If you have any enquiry about cooperation, please feel free to email us.

 

Product Introduction

 

FCF, flexible copper foil is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.

 

Dimension Range

 

Thickness: 9µm~35µm

 

Performance

 

The product surface is black or red, has lower surface roughness.

 

Applications

 

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

 

Features

 

High density, high bending resistance and good etching performance.

 

Microstructure

product-348-146
SEM(Rough Side after Treatment)
product-347-145
SEM(Before Surface Treatment)
product-348-148
SEM(Shiny Side after Treatment)

Table1- Performance (GB/T5230-2000,IPC-4562-2000)

 

Classification

Unit

9μm

12μm

18μm

35μm

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

153±5

283±7

Tensile Strength

R.T.(23℃)

Kg/mm2

≥28

H.T.(180℃)

≥15

≥15

≥15

≥18

Elongation

R.T.(23℃)

%

≥5.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥6.0

≥6.0

≥8.0

≥8.0

Roughness

Shiny(Ra)

μm

≤0.43

Matte(Rz)

≤2.5

Peel Strength

R.T.(23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤7.0

Change of color(E-1.0hr/200℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Appearance(Spot and copper powder)

----

None

Pinhole

EA

Zero

Size Tolerance

Width

mm

0~2mm

Length

mm

----

Core

Mm/inch

Inside Diameter 79mm/3 inch

 

Note: 1. Copper foil oxidation resistance performance and surface density index can be negotiated.

2. The performance index is subject to our testing method.

3. The quality guarantee period is 90 days from the date of receipt.

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