With the widespread adoption of new energy vehicles and 5G communication, the demand for high-temperature resistant copper foil continues to grow. Current R&D priorities include:
Ultra-thinning: Achieving ultra-thin copper foil (below 3μm) through electrolytic deposition processes to meet the demands of high-density interconnects.
Low loss: Reducing high-frequency signal loss through surface roughness control (Ra≤0.1μm), suitable for millimeter-wave communication.
Environmentally friendly: Developing lead-free surface treatment processes to comply with RoHS and REACH regulations.
