9μm High-Precision RA Copper Foil

Base Material: High-purity copper substrate selected for the production of thin rolled annealed copper foil with consistent electrical and mechanical properties.

Grain Structure: Controlled recrystallized grain structure developed through precision rolling and annealing to support uniform deformation and stable foil performance.

Material Consistency: Controlled material processing helps maintain consistent thickness, mechanical properties, and surface quality across the finished foil.

Dimensional Stability: A thickness tolerance of ±0.3 μm supports consistent foil dimensions across the coil and helps maintain stable performance in precision applications.

Flexural Performance: The rolled annealed structure provides the flexibility required for applications involving repeated bending and forming, including flexible circuit applications.

Surface Quality: Controlled surface roughness supports stable contact, coating, and lamination performance where consistent foil surface characteristics are required.

Thermal Performance: Controlled rolling and annealing help maintain stable mechanical properties during downstream processing and thermal exposure.

Precision Rolling: Multi-high cold rolling equipment with Automatic Gauge Control (AGC) is used to maintain consistent foil thickness during precision rolling.

Controlled Annealing: Controlled annealing processes help achieve a consistent grain structure and stable mechanical properties throughout the foil.

Surface Inspection: Optical inspection is used to identify surface defects such as pinholes, micro-scratches, and roller marks during production.

Laboratory Verification: Finished material is evaluated for key properties including tensile strength, dimensional accuracy, surface characteristics, and electrical conductivity to support consistent product quality.

Flexible Printed Circuit Boards (FPC): Used for flexible circuit applications where thin copper foil, dimensional consistency, and bending performance are required.

Energy Storage Systems: Suitable for applications requiring thin copper current collectors and controlled foil dimensions in high-density energy storage systems.

High-Frequency Electronics: Used in high-frequency circuit applications where stable thickness, electrical conductivity, and controlled surface characteristics are important.

EMC Shielding: Suitable for electromagnetic interference shielding applications in electronic and automotive systems requiring thin, conductive copper foil.

Precision Slitting: Slit widths can be supplied within the available 20–600 mm width range according to application and processing requirements.

Surface Treatment: Optional surface treatment can be considered for applications requiring additional oxidation protection or specific adhesion characteristics.

Mechanical Tuning: Rolling and annealing conditions can be adjusted according to specified requirements for bending, forming, and other downstream processing conditions.

Protective Packaging: Copper foil coils are packaged with moisture-resistant and impact-protection materials to help maintain product condition during storage and international transportation.

Oxidation Protection: Moisture-barrier packaging and desiccant can be used to reduce exposure to humidity and help protect the copper foil surface during transit.

Product Traceability: Product identification and quality documentation are provided according to order and lot requirements to support material traceability.