Civen Metal Material (Shanghai) Co., Ltd. is one of the leading manufacturers and suppliers of 2l flexible copper clad laminate in China. Welcome to buy bulk durable 2l flexible copper clad laminate made in China here from our factory. If you have any enquiry about cooperation, please feel free to email us.
2L FCCL Structure and Material Options
2L flexible copper clad laminate consists of copper foil and polyimide (PI) film. Unlike adhesive-based 3L FCCL constructions, the listed 2L range uses a two-layer structure. CIVEN Metal offers models with electrodeposited (ED) and rolled annealed (RA) copper foil.
The available models differ in copper foil weight and PI film thickness. These differences give circuit designers and material purchasers a clear starting point when matching the laminate to a flexible circuit design.
Technical Specifications
The current product range includes seven models. Five use ED copper foil, while two use RA copper foil.
| Product Code | Copper Foil Type | Copper Foil Weight | PI Film Thickness | Structure |
|---|---|---|---|---|
| MG2DB1003EH | ED | 1/3 oz on each side | 1.0 mil | Cu / PI / Cu |
| MG2DB1005EH | ED | 1/2 oz on each side | 1.0 mil | Cu / PI / Cu |
| MG2DF0803ER | ED | 1/3 oz on each side | 0.8 mil | Cu / PI / Cu |
| MG2DF1003ER | ED | 1/3 oz on each side | 1.0 mil | Cu / PI / Cu |
| MG2DF1005ER | ED | 1/2 oz on each side | 1.0 mil | Cu / PI / Cu |
| MG2DF1003RF | RA | 1/3 oz on each side | 1.0 mil | Cu / PI / Cu |
| MG2DF1005RF | RA | 1/2 oz on each side | 1.0 mil | Cu / PI / Cu |
The copper foil weight is specified for each side of the laminate. The product code should be checked against the required foil type, copper weight and PI film thickness when selecting a model.
Performance Characteristics
The PI-based construction provides a flexible substrate for electronic circuits where space, weight and bending requirements matter. The published product information also identifies the following characteristics:
• Electrical performance: The low dielectric constant is relevant to applications involving high-speed signal transmission.
• Flexibility: The laminate is intended for flexible circuit designs, including compact assemblies and applications requiring flexible connections.
• Thermal performance: Heat resistance and thermal stability are listed product characteristics for electronic applications with elevated operating temperatures.
• Roll-form supply: The material can be used in continuous processing and automated flexible circuit manufacturing.
Actual performance depends on the selected model, circuit design and processing conditions. Where a project requires specific dielectric, thermal, bending or reliability values, request the corresponding technical data before final material approval.
Application
The listed application areas for 2L FCCL include:
Flexible printed circuit boards (FPCs)
Rigid-flex printed circuit boards
Chip on Film (COF)
High-frequency communication devices and antenna components
Automotive electronics
These applications involve different circuit layouts and operating conditions, so the required copper foil type, copper weight and PI film thickness should be confirmed against the design specification.
For projects comparing two-layer and three-layer flexible copper clad laminates, see 3L Flexible Copper Clad Laminate. The 3L range includes copper foil, epoxy adhesive and PI film constructions, while the 2L products listed here use a two-layer copper foil and PI film structure.
Request 2L FCCL Specifications
When requesting a quotation, provide the product code if a listed model meets your requirements. Otherwise, specify the preferred copper foil type (ED or RA), copper foil weight, PI film thickness and intended application.
If the project has defined electrical, thermal or bending requirements, include the relevant targets so the appropriate construction and supporting technical documentation can be reviewed.
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