Civen Metal Material (Shanghai) Co., Ltd. is one of the leading manufacturers and suppliers of high-peel-strength ra copper foil in China. Welcome to buy bulk durable high-peel-strength ra copper foil made in China here from our factory. If you have any enquiry about cooperation, please feel free to email us.
High-Peel-Strength RA Copper Foil for Flexible Circuits
High-Peel-Strength RA Copper Foil combines a rolled-annealed copper structure with a controlled micro-roughened bonding surface to improve adhesion between the copper conductor and dielectric substrates.
Precision mechanical rolling and controlled thermal treatment help maintain the mechanical properties required for repeated bending, while the bonding-side micro-treatment provides mechanical anchoring with resin systems used in flexible circuit construction.
The foil is supplied in master rolls and slitted coils for reel-to-reel processing. It is suitable for flexible printed circuits, rigid-flex boards, automotive electronics, and other applications where copper-to-dielectric adhesion must remain stable during thermal and mechanical cycling.
Key Material
Base Material: Electrolytic copper cathode, Cu-ETP / C11000 or Cu-OF / C10200, with a minimum purity of 99.9%.
Microstructure: Equiaxed grain structure oriented along the rolling direction to support bending endurance in flexible electronic applications.
Bonding-Side Treatment: A nodular micro-treatment is applied to the bonding side to improve mechanical anchoring with dielectric materials. A passivation barrier is also used to reduce high-temperature discoloration and oxidation.
Performance Features
High Peel Strength: Peel strength reaches ≥0.8 kN/m with polyimide, helping resist delamination during lead-free reflow soldering from 260°C to 288°C.
Flex Endurance: The foil withstands more than 100,000 MIT folding cycles at a 0.8 mm bend radius without conductor fracture.
Controlled Surface Profile: The low-profile matte surface helps reduce signal insertion loss in high-frequency circuits operating above 10 GHz.
Thermal Retention: The material is designed to maintain its tensile strength and elongation characteristics after thermal exposure.
For applications where oxidation resistance during storage and thermal processing is a primary requirement, Anti-Oxidation Treated RA Copper Foil is another treated RA copper option.
Technical Specifications
| Parameter | Specification |
|---|
| Base Material | Cu-ETP / C11000 or Cu-OF / C10200 |
| Copper Purity | ≥99.9% |
| Nominal Thickness | 12–35 μm |
| Thickness Tolerance | ±5% |
| Peel Strength with PI Film | ≥0.8 kN/m |
| Tensile Strength | 250–380 MPa |
| Elongation at Break | 15–35% |
| Surface Roughness, Matte Side | Rz 0.8–1.8 μm |
| Electrical Conductivity | ≥98% IACS at 20°C |
| Standard Width | 100–620 mm |
| Slitting Tolerance | ±0.1 mm |
The standard thickness range is 12–35 μm. Custom gauges from 9–70 μm are available according to application requirements.
Manufacturing & Quality Control
The foil is produced through precision multi-high reversing rolling mills equipped with automatic gauge control and online surface inspection.
Continuous strand annealing under a controlled N₂/H₂ reducing atmosphere is used to relieve residual stress and control the copper grain structure. The bonding surface is then processed through automated electro-deposition and passivation equipment with real-time bath monitoring.
Finished coils undergo 100% optical surface inspection for defects such as pinholes and edge cracks. Mechanical and peel properties are batch-tested according to applicable IPC-TM-650 methods.
Applications
Flexible Printed Circuits
The combination of high peel strength and bending endurance makes this foil suitable for FPC structures using polyimide and other flexible dielectric materials.
Foldable Electronics
The foil can be used in dynamic flex circuits for foldable smartphones and dual-screen laptops where repeated bending places mechanical demands on the conductor.
Automotive Electronics
Applications include transmission control units (TCU), battery management systems (BMS), and ADAS sensor ribbons exposed to vibration and thermal cycling.
Aerospace & Defense Electronics
The material can be used for lightweight flat harnesses and internal wiring assemblies exposed to vibration and thermal shock.
High-Density Interconnects
For multi-layer rigid-flex boards, the treated bonding surface helps maintain copper-to-dielectric adhesion through lamination pressing cycles.
For designs requiring a defined roughened surface on only one side, Single-Side Roughened RA Copper Foil provides a related surface-treatment option.
Customization and Supply Options
Custom specifications can be provided for applications with specific thickness, adhesion, surface, or slitting requirements.
Custom Thickness: 9–70 μm
Surface Treatment: Single-side or double-side treatment
Adhesive Compatibility: Epoxy, acrylic, and modified polyimide adhesive systems
Core Inner Diameter: 3 inches (76.2 mm) or 6 inches
Slitting Width: Down to 10 mm
Edge Burr: Less than 10% of foil thickness
Trial Rolls: 5–20 kg
Documentation: Certificate of Analysis (CoA) and Material Safety Data Sheet (MSDS)
Trial quantities can be used for process evaluation before regular production orders.
Packaging & Delivery
Each coil is supplied in suspended horizontal wooden crate packaging. The material is vacuum-sealed in an anti-static moisture-barrier bag with desiccant and nitrogen purging to reduce exposure to moisture and oxidation during transportation.
HDPE edge guards are used to protect the coil edges from physical damage. Master coils carry laser-etched barcodes and labels identifying the alloy grade, batch number, weight, and production date for traceability.
Standard production lead time is 15–25 days. Stock items can ship within 5 business days.
FAQ
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