Treated RA Copper Foil
CIVEN Metal's Treated RA Copper Foil combines a rolled-annealed copper base with controlled surface treatment for applications where copper-to-resin adhesion, surface protection, and electrical performance are important.
The range includes single-side treated, double-side treated, single-side roughened, anti-oxidation, high-peel-strength, and high-temperature treated RA copper foils. These options are designed for flexible circuits, high-frequency electronics, automotive electronics, and other applications that require a controlled copper surface.
Product Overview
Treated RA Copper Foil starts with high-purity rolled and annealed copper foil. A controlled surface treatment is then applied to modify the copper surface according to the requirements of the downstream application.
Compared with untreated RA copper foil, the treated surface can provide additional functions such as improved resin adhesion, oxidation protection, and controlled surface roughness.
The current product range includes:
• High-Temperature Treated RA Copper Foil
• Anti-Oxidation Treated RA Copper Foil
• High-Peel-Strength RA Copper Foil
• Single-Side Roughened RA Copper Foil
• Double-Side Treated RA Copper Foil
• Single-Side Treated RA Copper Foil
Surface Treatment Options
Single-Side Treated RA Copper Foil
One side of the foil receives the treatment while the opposite side remains comparatively smooth. This configuration can be considered when different surface characteristics are required on the two sides of the copper foil.
Double-Side Treated RA Copper Foil
Both surfaces are treated for applications where copper-to-resin adhesion or surface characteristics are required on both sides.
Single-Side Roughened RA Copper Foil
A micro-roughened surface is provided on one side to improve resin anchoring, while the opposite side is maintained as a smoother surface for applications where controlled surface profile is important.
Anti-Oxidation Treated RA Copper Foil
An anti-oxidation treatment is applied to protect the copper surface during storage, handling, and subsequent processing.
High-Peel-Strength RA Copper Foil
This option is intended for applications where stronger bonding between the copper foil and dielectric materials is an important part of the material specification.
High-Temperature Treated RA Copper Foil
This product is intended for electronic substrate applications where the surface treatment needs to withstand higher-temperature processing conditions.
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![High-Temperature Treated RA Copper Foil]()
High-Temperature Treated RA Copper FoilCIVEN Metal High-Temperature Treated RA Copper Foil is designed for electronic substrates exposed to elevated-temperature manufacturing and repeated mechanical stress. Produced from high-purity... -
![Anti-Oxidation Treated RA Copper Foil]()
Anti-Oxidation Treated RA Copper FoilAnti-Oxidation Treated RA Copper Foil is a high-purity rolled-annealed copper foil with a thin passivation layer designed to reduce oxidation during high-temperature processing and storage. It... -
![High-Peel-Strength RA Copper Foil]()
High-Peel-Strength RA Copper FoilHigh-Peel-Strength RA Copper Foil is a rolled-annealed copper foil designed for flexible printed circuits and electronic substrates requiring reliable adhesion between copper conductors and... -
![Single-Side Roughened RA Copper Foil]()
Single-Side Roughened RA Copper FoilSingle-Side Roughened RA Copper Foil features a micro-roughened surface on one side for resin anchorage and a smooth reverse side for high-frequency signal transmission. Produced through precision... -
![Double-Side Treated RA Copper Foil]()
Double-Side Treated RA Copper FoilDouble-Side Treated RA Copper Foil features controlled micro-roughened surfaces on both sides to improve adhesion with dielectric materials in multilayer flexible circuits. Produced from... -
![Single-Side Treated RA Copper Foil]()
Single-Side Treated RA Copper FoilSingle-Side Treated RA Copper Foil features a micro-roughened treated side for strong dielectric bonding and an untreated smooth side optimized for fine-line etching. Produced from high-purity...
Base Material: High-purity oxygen-free copper, with copper content ≥99.99% according to the current product specification.
The treated surface consists of functional layers designed for different processing requirements:
Bonding Layer: Electro-deposited copper micro-nodules for resin interlocking.
Barrier Layer: Zinc-nickel alloy layer for copper migration control.
Passivation Layer: Organic anti-tarnish coating for surface protection before downstream processing.
The exact treatment configuration should be selected according to the dielectric material, bonding process, temperature conditions, and required surface performance.
Performance Characteristics
Peel Strength
The treated surface is designed to improve bonding between the copper foil and dielectric materials such as polyimide.
Surface Protection
Passivation helps reduce oxidation of the copper surface during storage and before lamination or other downstream processes.
Controlled Surface Roughness
Different treated surfaces provide different roughness profiles according to the requirements of bonding and high-frequency applications.
Flexibility
Because the base material is rolled and annealed copper foil, the product retains the flexibility characteristics associated with RA copper foil.
Technical Specifications
| Parameter | Standard Value / Range | Test Standard |
|---|---|---|
| Copper Purity | ≥99.99% | ICP-OES |
| Density | 8.96 g/cm³ | ASTM B170 |
| Electrical Conductivity | ≥98% IACS at 20°C | Eddy Current Meter |
| Surface Roughness, Matte Side (Rz) | 0.8–1.8 μm | Laser Confocal Microscope |
| Surface Roughness, Shiny Side (Rz) | 0.4–0.8 μm | Laser Confocal Microscope |
| Peel Strength on PI Film | ≥1.2 N/mm | IPC-TM-650 2.4.8 |
Available Thickness & Width
| Thickness | Thickness Tolerance | Standard Width | Width Tolerance |
|---|---|---|---|
| 12 μm | ±0.8 μm | 100–620 mm | ±0.2 mm |
| 18 μm | ±1.0 μm | 100–620 mm | ±0.2 mm |
| 35 μm | ±1.5 μm | 100–620 mm | ±0.3 mm |
| 70 μm | ±2.0 μm | 100–620 mm | ±0.3 mm |
Surface / Temper / Mechanical Properties
| Temper | Tensile Strength | Elongation | Typical Application |
|---|---|---|---|
| Soft (O) | 200–260 MPa | ≥30% | Ultra-flexible hinges and dynamic areas |
| Half-Hard (H2) | 280–360 MPa | ≥15% | Rigid-flex transition zones |
| Full-Hard (H) | ≥380 MPa | ≥5% | Flat traces and structural sections |
Manufacturing and Quality Control
Rolling
The copper substrate is produced through controlled rolling with thickness and tension monitoring.
Annealing
Controlled-atmosphere annealing is used to adjust the material structure and mechanical properties after rolling.
Surface Treatment
The copper foil passes through controlled treatment processes to develop the required roughness, bonding, and protective surface characteristics.
Inspection
Quality control covers dimensional, surface, electrical, and treatment-related properties. The current production description also lists pinhole detection, optical surface inspection, and batch testing for peel strength and chemistry.
Flexible Printed Circuits
Treated RA copper foil can be used in FPC applications where copper-to-polyimide adhesion, flexibility, and controlled surface characteristics are required.
High-Frequency Electronics
Selected surface configurations can be used for high-frequency applications where surface roughness and conductor performance need to be considered together.
Automotive Electronics
Treated RA copper foil can be applied to flexible electronic circuits and other automotive electronic components requiring controlled surface properties.
Medical Electronics
The material can be considered for flexible electronic and signal-carrying applications in medical devices where the required copper and surface specifications match the application.
Customization and Slitting
CIVEN Metal can discuss customized treated RA copper foil configurations according to the customer's application and downstream process.
When requesting a quotation, please provide:
• Required thickness
• Width
• Copper grade
• Temper
• Single-side or double-side treatment
• Required surface roughness
• Target dielectric or adhesive material
• Application
• Downstream lamination or bonding process
• Estimated quantity
Core sizes of 76 mm (3 inch) and 152 mm (6 inch) are listed in the current product information.
Packaging and Delivery
The foil is packaged to protect the treated surface, edges, and roll core during transportation.
Packaging and shipping requirements can be confirmed according to the roll configuration, destination, and order requirements.
For custom gauge, surface treatment, or slitting requirements, production and delivery schedules should be confirmed before order placement.
Quality and Technical Documentation
CIVEN Metal states that treated RA copper foil can be supplied with Mill Test Certificates containing product-specific material and performance information.
For customers validating a new foil in their production process, sample requirements can be discussed based on the target thickness, surface treatment, substrate, and application.
Civen Metal Material (Shanghai) Co., Ltd. is one of the most professional treated ra copper foil manufacturers and suppliers in China. With abundant experience, we warmly welcome you to wholesale bulk high quality treated ra copper foil made in China here from our factory. Good service and reasonable price are available.
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