18μm Standard RA Copper Foil

Base Material: Electrolytic Tough Pitch (ETP) Copper (C11000) or Oxygen-Free High Conductivity (OFHC) Copper (C10200).
Copper Purity: >= 99.9%.
Microstructure: Recrystallized equiaxed grain structure achieved via controlled cold-rolling and continuous bright annealing, eliminating internal stresses to optimize bend enduranc 

Dynamic Flexural Endurance: Withstands over 100,000 bending cycles in sliding and folding configurations without micro-cracking.
Thermal Stability: Controlled internal residual stress prevents wrinkling, shrinkage, or delamination during high-pressure polyimide (PI) coverlay lamination and survives multiple thermal excursions up to 280 deg C during lead-free SMT reflow.
Mechanical Strength: Maintained at >= 250 MPa tensile strength with 15% - 30% elongation, resisting deformation during automated roll-to-roll web handling.
Signal Integrity: Low surface roughness (Rz <= 1.2 um) minimizes skin effect losses, enabling high-frequency analog and digital transmission up to 40 GHz. 

Cold Rolling: Multi-pass Sendzimir and 4-high rolling mills reduce master ingots to 18 um with thickness variations kept strictly within +/- 5%.
Continuous Annealing: Hydrogen-nitrogen atmosphere vertical furnaces relieve internal stress and control grain size distribution.
Inline Inspection: Automated optical surface inspection (AOI) systems detect pinholes, pits, scratches, and oxidation spots across the web in real time.
Compliance: Certified to ISO 9001:2015 and IATF 16949 standards. Fully compliant with RoHS and REACH directives.
Traceability: Each master coil is laser-marked with a unique ID linked to raw material melt logs, reduction ratios, and destructive tensile test records provided in the Mill Test Certificate (MTC). 

Foldable Display FPCs: Interconnect substrates for hinged OLED panels requiring million-fold dynamic flexing.
Automotive Sensor Harnesses: Under-hood cabling, battery management system (BMS) connections, and seat-occupancy sensor circuits exposed to constant vibration and thermal cycling.
Aerospace Avionics: Lightweight rigid-flex PCBs operating under severe thermal shock and mechanical stress.
EMI Shielding: Conductive layers in flexible flat cables (FFC) and high-speed communication modules. 

Width Range: Slit widths from 10 mm to 600 mm (+/- 0.1 mm tolerance).
Surface Treatments: Optional anti-tarnish passivation (chromate or organic) and mechanical/chemical roughening engineered to optimize peel strength with specific polyimide (PI) or PET adhesives.
Core Diameters: 3-inch (76.2 mm) and 6-inch (152.4 mm) stainless steel or PP cores. 

Packaging: Coils are suspended in anti-static, moisture-barrier vacuum bags with silica gel desiccants, packed inside rugged wooden suspension crates to prevent edge damage and telescoping during transit.
Shelf Life: 6 months from the manufacturing date in a climate-controlled environment (20 deg C +/- 5 deg C, relative humidity < 60%).
Logistics: Shipped via air or sea freight with continuous temperature and shock data loggers available upon request. 

Mill-Direct Control: In-house operations spanning precision rolling, continuous heat treatment, micro-slitting, and laboratory testing ensure uniform metallurgical properties batch after batch.
Strict Tolerance Enforcement: Advanced beta-ray thickness monitoring guarantees deviation stays within +/- 1 um, directly reducing etching defects, impedance variations, and scrap rates in fine-line PCB manufacturing.
Audit-Ready Documentation: Every shipment includes a verified MTC detailing exact chemical composition, tensile strength, elongation, and surface roughness metrics.