18μm Standard RA Copper Foil

Base Material：Electrolytic Tough Pitch (ETP) Copper (C11000) or Oxygen-Free High Conductivity (OFHC) Copper (C10200), according to the specified material grade.

Copper Purity：Copper purity is controlled according to the applicable material specification.

Microstructure：Recrystallized grain structure developed through controlled cold rolling and continuous annealing to support the flexibility and mechanical performance required for RA copper foil applications.

Flexibility and Ductility: The rolled-annealed structure provides the flexibility and elongation required for bending, forming, and applications involving repeated movement.

Mechanical Strength: A tensile strength range of 250–320 MPa, combined with elongation of at least 15%, provides a balance of strength and ductility for downstream handling and processing.

Surface Profile: Anti-tarnish treatments and surface roughening can be specified for applications requiring improved oxidation resistance or better adhesion with PI and PET materials. For applications requiring a treated copper foil surface, see Treated RA Copper Foil.

Electrical Conductivity: Electrical conductivity of ≥98% IACS at 20°C provides the conductive performance required for electronic applications using thin copper foil.

Controlled Cold Rolling: Multi-pass cold rolling is used to reduce copper stock to the target 18μm thickness while maintaining a consistent thickness profile across the foil.

Continuous Annealing: Controlled-atmosphere annealing relieves internal stress and develops a stable recrystallized grain structure, supporting the flexibility and dimensional stability required for thin RA copper foil.

In-Line Inspection: Surface inspection is used to identify defects such as pinholes, pits, scratches, and oxidation marks during production.

Quality Verification: Finished foil is checked for key properties including thickness, tensile strength, elongation, electrical conductivity, surface roughness, and material purity according to the applicable inspection methods.

Compliance & Traceability: Production and quality records support batch-level traceability, with Mill Test Certificate (MTC) documentation available for material verification. CIVEN Metal states compliance with ISO 9001:2015, IATF 16949, RoHS, and REACH requirements.

Flexible Printed Circuits (FPCs): The 18μm gauge and rolled-annealed structure provide the flexibility and dimensional control required for flexible circuit applications involving bending, forming, and compact circuit layouts.

Flexible Cables and FFCs: Thin copper foil can be used as a conductive layer in flexible cable structures where low material thickness and reliable electrical conductivity are important.

EMI Shielding: The foil can be used in shielding structures for electronic assemblies and communication components where a thin, conductive material is required.

Automotive Electronics: Suitable for selected automotive electronic circuits and sensor-related applications that require a combination of electrical conductivity, flexibility, and mechanical stability.

Specialized Laminates: The foil can be laminated with polymer materials such as polyimide (PI) for flexible electronic structures and other applications requiring a thin conductive layer.

Custom Slitting: The 18μm RA copper foil can be slit to widths from 10 mm to 600 mm, with a specified slit-width tolerance of ±0.1 mm for applications requiring controlled material dimensions.

Surface Options: Anti-tarnish treatments and surface roughening can be specified for applications requiring improved oxidation resistance or better adhesion with PI and PET materials.

Core Options: 3-inch (76.2 mm) and 6-inch (152.4 mm) stainless steel or PP cores are available according to winding and processing requirements.

Material Configuration: For quotation and production planning, customers can specify the required foil width, surface condition, core configuration, and intended application so the material can be matched to the downstream process.

Coil Protection: Copper foil coils are packaged with moisture-barrier and anti-static protection to help maintain surface condition during storage and transportation. Protective packing is used to reduce the risk of edge damage and coil deformation during handling.

Storage: The recommended storage environment is climate-controlled, with a temperature of 20°C ±5°C and relative humidity below 60%. Under the specified storage conditions, the stated shelf life is 6 months from the manufacturing date.

Transportation: Air and sea freight options are available. Temperature and shock data logging can be arranged for shipments when required by the customer.

Shipping Documentation: Material and quality documentation can be provided with shipments to support incoming inspection and material traceability.

Mill-Direct Production: CIVEN Metal manages rolling, continuous heat treatment, slitting, and laboratory testing within its production system, supporting consistent material properties across batches.

Controlled Thickness: Thickness monitoring during production helps maintain the specified 18μm gauge and supports consistent dimensional performance for downstream processing.

Material Documentation: Mill Test Certificates (MTCs) provide key material and quality data, including chemical composition, tensile strength, elongation, and surface roughness, supporting incoming inspection and material traceability.