35μm Standard RA Copper Foil

35μm Standard RA Copper Foil

CIVEN Metal’s 35μm Standard RA Copper Foil is a rolled-annealed copper foil designed for electronic applications that require consistent thickness, high ductility, and reliable electrical conductivity. Its 35μm gauge provides a balance of flexibility and mechanical stability for applications such as flexible circuits, shielding materials, and electronic connectors.
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Description
Technical Parameters

Civen Metal Material (Shanghai) Co., Ltd. is one of the leading manufacturers and suppliers of 35μm standard ra copper foil in China. Welcome to buy bulk durable 35μm standard ra copper foil made in China here from our factory. If you have any enquiry about cooperation, please feel free to email us.

 

The 35μm Standard RA Copper Foil is produced through ingot casting, multi-stage cold rolling, and controlled-atmosphere annealing to develop a homogeneous grain structure and consistent material properties across the foil. The rolled-annealed structure provides the ductility and bending resistance required for applications involving repeated flexing or forming.

For electronic manufacturing, the foil can be used as a base material for flexible printed circuits (FPCs), shielding laminates, and electronic connectors where thickness consistency, surface condition, and electrical conductivity are important to downstream processing.

 

Key Material

Base Metal

Electrolytic Tough Pitch (ETP) copper or Oxygen-Free High Thermal Conductivity (OFHC) copper, depending on the specified material grade.

Copper Purity

>= 99.9%.

Microstructure

Recrystallized grain structure developed through controlled rolling and annealing, providing the ductility required for forming and bending applications.

 

Performance Features

 

Flexibility and Ductility: The rolled-annealed structure provides the flexibility and elongation needed for forming, bending, and applications involving repeated movement.

Controlled Surface Profile: Consistent surface characteristics support downstream processes such as lamination, etching, and bonding.

Mechanical Balance: The material combines tensile strength with elongation to provide stable handling during processing while maintaining the flexibility expected from RA copper foil.

Thickness Consistency: A controlled rolling and annealing process helps maintain consistent foil thickness across the specified width.

Surface Condition: A controlled surface condition supports reliable contact and bonding in electronic material applications.

 

Technical Specifications

 

Parameter

Specification Value

Test Standard

Nominal Thickness

35um (+/- 1.5um)

IPC-TM-650 2.2.18

Areal Weight

~ 311.5 g/m2

Gravimetric

Copper Purity

>= 99.9%

ICP-OES

Tensile Strength

250 - 350 MPa

IPC-TM-650 2.4.18

Elongation

>= 15%

IPC-TM-650 2.4.18

Surface Roughness (Rz)

Matte side: 1.2 - 2.5um; Shiny side: < 1.0um

JIS B 0601

Electrical Conductivity

>= 100% IACS at 20°C

ASTM B193

Standard Width

100mm - 620mm

Direct Measurement

 

Manufacturing & Quality Control

 

Melting & Casting: Copper is prepared through controlled melting and casting to provide a consistent material base for subsequent rolling and annealing processes.

Precision Cold Rolling: Multi-pass cold rolling is used to control foil thickness and develop the required mechanical properties. Process parameters are monitored throughout production to maintain consistent thickness across the coil.

Continuous Annealing: Controlled-atmosphere annealing relieves internal stress and develops the recrystallized grain structure required for the flexibility and elongation of RA copper foil.

In-Line Inspection: Surface condition and dimensional characteristics are monitored during production to identify pinholes, surface defects, and other abnormalities before the finished foil is released.

Quality Verification: Finished material is tested for key properties such as thickness, tensile strength, elongation, copper purity, surface roughness, and electrical conductivity according to the applicable test methods.

Batch Documentation: Quality records are maintained for each production batch, with inspection results available for customer review and shipment documentation.

 

Applications

 

The 35μm Standard RA Copper Foil is suitable for electronic components and assemblies where controlled thickness, electrical conductivity, and flexibility are important to material selection.

Flexible Printed Circuits (FPCs)
Used as a conductive layer in flexible circuit structures where the copper foil needs to withstand bending and downstream forming processes.

Shielding Materials
Suitable for electromagnetic shielding structures that require a conductive copper layer with consistent thickness and surface characteristics.

Flexible Flat Cables (FFCs)
Can be used as a conductive material in flexible flat cable structures where electrical conductivity and mechanical flexibility are required.

Battery Components
Applicable to selected battery-related components and conductive structures where copper foil thickness, conductivity, and formability meet the requirements of the specific design.

 

Customization & OEM Supply

 

Standard 35μm RA copper foil can be prepared according to the dimensional and processing requirements of the intended application. When requesting a quotation, buyers can provide the required width, coil configuration, core specification, surface treatment, and other relevant processing requirements for confirmation.

Slitting:The master coil can be slit into narrower widths according to the required finished dimensions and downstream processing requirements.

Surface Treatments:Additional surface treatments can be discussed for applications requiring specific bonding, corrosion resistance, oxidation protection, or other surface characteristics. For applications where the surface condition is an important part of material selection, Treated RA Copper Foil is another option to consider.

Core Options:Core dimensions and winding configurations can be confirmed according to the customer's equipment, handling requirements, and finished coil dimensions.

Sampling:Samples can be arranged for material evaluation and process testing before regular production. Sample requirements should include the intended application, required dimensions, and any specific surface or mechanical requirements.

 

Packaging & Delivery

Packaging is arranged to protect the copper foil from moisture, contamination, surface damage, and deformation during handling and transportation. 

Interleaving

Protective interleaving materials can be used between foil layers where required to help prevent surface contact and abrasion during handling.

Sealing

Finished coils are securely wrapped and sealed to provide protection against moisture and external contamination during storage and transportation.

Crate Protection

Appropriate external protection is used for coil handling and shipment, with packaging configured according to the coil dimensions and transportation requirements.

Logistics

Shipping arrangements are confirmed according to the order quantity, destination, delivery requirements, and agreed trade terms. Packaging and shipping requirements can be specified when placing an order.

 

Why CIVEN Metal

 

Direct Mill Operation:Direct manufacturing access supports communication on material specifications, processing requirements, and production arrangements without relying solely on third-party sourcing.

Material Traceability:Production and inspection records provide traceability for finished material and help support quality review throughout the supply process.

Consistent Gauge Control:Controlled rolling and inspection processes help maintain the specified foil thickness and material properties from coil to coil.

 

FAQ

 

Q: What is 35μm Standard RA Copper Foil?

A: 35μm Standard RA Copper Foil is a rolled-annealed copper foil produced through controlled rolling and annealing. It is used in electronic applications where electrical conductivity, flexibility, ductility, and consistent thickness are required.

Q: What is the difference between RA copper foil and ED copper foil?

A: RA (rolled-annealed) copper foil is produced through rolling and annealing, while ED (electrodeposited) copper foil is formed through an electrochemical deposition process. Their different manufacturing methods result in different mechanical and surface characteristics, so material selection should be based on the requirements of the finished application and manufacturing process.

Q: What applications can use 35μm Standard RA Copper Foil?

A: Typical applications include flexible printed circuits (FPCs), flexible flat cables (FFCs), electromagnetic shielding materials, and selected battery-related conductive components. The suitability of the material depends on the electrical, mechanical, dimensional, and processing requirements of the specific application.

Q: Can 35μm RA Copper Foil be supplied in custom widths?

A: Yes. The standard foil can be slit into narrower widths according to the required finished dimensions. Buyers should provide the target width, coil configuration, core requirements, and intended application when requesting a quotation.

Q: What information should be provided when requesting a quotation?

A: Useful information includes the required foil thickness, width, quantity, coil or core dimensions, surface requirements, application, and any specific mechanical or electrical requirements. Providing these details helps CIVEN Metal confirm the appropriate material configuration and supply requirements.

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