Standard RA Copper Foil

 

CIVEN Metal's Standard RA Copper Foil is produced through cold rolling and controlled annealing to achieve a uniform material structure, consistent thickness, and the mechanical flexibility required by demanding electronic and industrial applications.

The standard range is available in ETP and oxygen-free copper grades, with thicknesses from 9 μm to 70 μm and widths from 10 mm to 620 mm. Different tempers and surface options can be selected according to the forming, bending, bonding, and processing requirements of the finished component.

 

Product Overview

 

Standard RA copper foil is a rolled copper material for applications where flexibility, conductivity, dimensional control, and mechanical performance need to be considered together.

Compared with electrodeposited copper foil, the rolled and annealed production process gives RA copper foil a different grain structure and mechanical behavior, making it particularly relevant to applications involving repeated bending or forming.

 
  • 70μm Standard RA Copper Foil
    CIVEN Metal 70μm Standard RA Copper Foil is a rolled annealed copper foil produced through repeated cold rolling and intermediate annealing. With a nominal thickness of 70 μm, it provides a...
  • 50μm Standard RA Copper Foil
    CIVEN Metal 50μm Standard RA Copper Foil is a rolled annealed copper foil produced through multi-pass cold rolling and controlled annealing. With a nominal thickness of 50 μm, it combines...
  • 35μm Standard RA Copper Foil
    CIVEN Metal’s 35μm Standard RA Copper Foil is a rolled-annealed copper foil designed for electronic applications that require consistent thickness, high ductility, and reliable electrical...
  • 18μm Standard RA Copper Foil
    CIVEN Metal’s 18μm Standard RA Copper Foil is a rolled-annealed copper foil designed for electronic applications requiring a thin, flexible, and electrically conductive material. Its 18μm...
  • 12μm Standard RA Copper Foil
    CIVEN Metal’s 12μm Standard RA Copper Foil is a thin rolled-annealed copper foil designed for electronic applications requiring flexibility, electrical conductivity, and controlled thickness. Its...
  • 9μm Standard RA Copper Foil
    CIVEN METAL 9μm Standard Rolled-Annealed (RA) Copper Foil is a thin copper foil designed for applications requiring controlled thickness, electrical conductivity, surface quality, and mechanical...
 
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Key Material

Base Materials:

ETP Copper — C11000 / Cu-ETP

Copper purity: ≥99.90%

 

Oxygen-Free Copper — C10200 / C10100

Copper purity: ≥99.99%

 

The available material should be selected according to the electrical, mechanical, forming, and processing requirements of the application.

 

Performance Features
 

Bending and Flexibility

The rolled and annealed structure provides the flexibility required for applications involving repeated bending and dynamic movement.

Electrical Conductivity

The ETP and OFE grades provide high electrical conductivity for electronic and electrical applications.

Formability

Different tempers can be selected according to the balance required between elongation, tensile strength, and forming performance.

Surface Control

Surface roughness and treatment options can be specified according to downstream bonding, etching, forming, or other processing requirements.

 

Technical Specifications

 

arameter Standard ETP Grade Oxygen-Free (OFE) Grade Test Standard
Copper Content ≥99.90% ≥99.99% ASTM B152 / JIS H3100
Electrical Conductivity ≥100% IACS ≥101% IACS ASTM B193
Density 8.94 g/cm³ 8.94 g/cm³ Archimedes Method
Surface Roughness (Rz) 0.6–1.5 μm 0.4–1.2 μm ISO 4287 / JIS B0601
Elongation at Break 15–35% by temper 18–40% by temper IPC-TM-650 2.4.18
Tensile Strength 200–450 MPa by temper 180–420 MPa by temper IPC-TM-650 2.4.18

 

Available Thickness and Width

 

Thickness Range

9–70 μm

01

Standard Thicknesses

9 μm, 12 μm, 18 μm, 35 μm, 70 μm

02

Width Range

10–620 mm, slit to specification

03

Thickness Tolerance

±1.0 μm for thickness below 18 μm; ±5% for thickness ≥18 μm

04

Core Inner Diameters

76 mm (3 inch) and 152 mm (6 inch)

05

 

Temper and Surface Options
 

Soft Annealed (O)

The soft annealed temper provides higher elongation and lower tensile strength for applications requiring greater formability.

Half-Hard (H02)

H02 provides a balance between tensile strength and formability for general applications where both properties are important.

Full-Hard (H04)

H04 provides higher tensile strength for applications requiring greater dimensional stiffness.

Plain Surface

The plain option provides a rolled surface with anti-oxidation passivation.

Roughness-Enhanced Surface

A nodular surface treatment can be used when increased surface roughness and peel strength are required for bonding with PI or PET films.

 

 

 

Manufacturing and Quality Control

Production Process

 

Cold Rolling

Multi-pass cold rolling reduces the copper foil to the required thickness under controlled rolling conditions.

Continuous Annealing

Controlled-atmosphere annealing adjusts the material structure and mechanical properties after rolling.

Surface Cleaning and Passivation

The foil is cleaned to remove processing residues and treated to improve surface protection.

Precision Slitting

The finished foil can be slit to the required width for downstream processing.

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Inspection and Testing

CIVEN Metal's inspection process covers key material characteristics including:

• Thickness and width

• Tensile strength and elongation

• Surface condition

• Electrical conductivity

• Surface defects

• Roll and dimensional consistency

Material Test Reports can be supplied with the shipment according to the applicable order requirements.

 

Quality Certifications

 

  • ISO 9001:2015 Quality Management System
  • IATF 16949:2016 Automotive Quality Management System
  • RoHS and REACH Compliance Reports supplied per batch.

 

Applications

 

Flexible Printed Circuits (FPC)

RA copper foil can be used in flexible circuit applications where repeated bending and mechanical flexibility are important.

01

Lithium-Ion Batteries

The foil can be considered for battery-related current-collecting and flexible electrical connection applications where the required material specification matches the design.

02

EMI Shielding

Copper foil can be used as a conductive layer for electromagnetic interference shielding in electronic equipment.

03

Precision Stamping

Different tempers allow the material to be selected according to the forming and mechanical requirements of precision electronic components.

04

 

Custom Slitting and Material Requirements

 

CIVEN Metal can provide slit widths and material configurations according to customer requirements.

When requesting a quotation, please provide:

• Required copper grade

• Thickness

• Width

• Temper

• Surface requirement

• Application

• Downstream processing method

• Required quantity

For trial production, sample or small-batch requirements can also be discussed with the sales team.

 

Packaging and Traceability

 

The foil is packaged to protect the roll, edges, surface, and core during transportation.

Each roll can be identified according to the applicable production and quality-control records to support product traceability.

Specific packaging, core, slitting, and shipping requirements can be confirmed before order placement.

 

Why Choose CIVEN Metal for Standard RA Copper Foil

 

 

Integrated Production Control

Cold rolling, annealing, surface processing, and slitting are coordinated within the production process.

 

Material Inspection

Key physical, mechanical, electrical, and dimensional properties are checked against the applicable product requirements.

 

Technical Transparency

Material and quality documentation can be provided for customers who need to verify material properties during incoming inspection or process validation.

 

 

FAQ

 

Q: What is Standard RA Copper Foil?

A: Standard RA Copper Foil is copper foil manufactured through rolling and annealing rather than electrodeposition. It is used in applications requiring a combination of electrical conductivity, flexibility, formability, and dimensional control.

Q: What copper grades are available?

A: The current product information lists ETP copper C11000 / Cu-ETP and oxygen-free copper C10200 / C10100.

Q: What thicknesses are available?

A: The stated thickness range is 9–70 μm, with standard thicknesses of 9, 12, 18, 35, and 70 μm.

Q: Can the foil be supplied in custom widths?

A: Yes. The stated width range is 10–620 mm, and the foil can be slit to specification.

Q: Which temper should I choose?

A: The choice depends on the required balance between elongation, tensile strength, flexibility, and forming performance. Soft annealed, half-hard, and full-hard options are available in the current product specification.

Q: What information should I provide when requesting a quotation?

A: Please provide the required copper grade, thickness, width, temper, surface requirement, application, processing method, and estimated quantity. These details help determine the appropriate material configuration.

Civen Metal Material (Shanghai) Co., Ltd. is one of the most professional standard ra copper foil manufacturers and suppliers in China. With abundant experience, we warmly welcome you to wholesale bulk high quality standard ra copper foil made in China here from our factory. Good service and reasonable price are available.

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