Standard RA Copper Foil
CIVEN Metal's Standard RA Copper Foil is produced through cold rolling and controlled annealing to achieve a uniform material structure, consistent thickness, and the mechanical flexibility required by demanding electronic and industrial applications.
The standard range is available in ETP and oxygen-free copper grades, with thicknesses from 9 μm to 70 μm and widths from 10 mm to 620 mm. Different tempers and surface options can be selected according to the forming, bending, bonding, and processing requirements of the finished component.
Product Overview
Standard RA copper foil is a rolled copper material for applications where flexibility, conductivity, dimensional control, and mechanical performance need to be considered together.
Compared with electrodeposited copper foil, the rolled and annealed production process gives RA copper foil a different grain structure and mechanical behavior, making it particularly relevant to applications involving repeated bending or forming.
-
70μm Standard RA Copper FoilCIVEN Metal 70μm Standard RA Copper Foil is a rolled annealed copper foil produced through repeated cold rolling and intermediate annealing. With a nominal thickness of 70 μm, it provides a...
-
50μm Standard RA Copper FoilCIVEN Metal 50μm Standard RA Copper Foil is a rolled annealed copper foil produced through multi-pass cold rolling and controlled annealing. With a nominal thickness of 50 μm, it combines...
-
35μm Standard RA Copper FoilCIVEN Metal’s 35μm Standard RA Copper Foil is a rolled-annealed copper foil designed for electronic applications that require consistent thickness, high ductility, and reliable electrical...
-
18μm Standard RA Copper FoilCIVEN Metal’s 18μm Standard RA Copper Foil is a rolled-annealed copper foil designed for electronic applications requiring a thin, flexible, and electrically conductive material. Its 18μm...
-
12μm Standard RA Copper FoilCIVEN Metal’s 12μm Standard RA Copper Foil is a thin rolled-annealed copper foil designed for electronic applications requiring flexibility, electrical conductivity, and controlled thickness. Its...
-
9μm Standard RA Copper FoilCIVEN METAL 9μm Standard Rolled-Annealed (RA) Copper Foil is a thin copper foil designed for applications requiring controlled thickness, electrical conductivity, surface quality, and mechanical...

Base Materials:
ETP Copper — C11000 / Cu-ETP
Copper purity: ≥99.90%
Oxygen-Free Copper — C10200 / C10100
Copper purity: ≥99.99%
The available material should be selected according to the electrical, mechanical, forming, and processing requirements of the application.
Performance Features
Bending and Flexibility
The rolled and annealed structure provides the flexibility required for applications involving repeated bending and dynamic movement.
Electrical Conductivity
The ETP and OFE grades provide high electrical conductivity for electronic and electrical applications.
Formability
Different tempers can be selected according to the balance required between elongation, tensile strength, and forming performance.
Surface Control
Surface roughness and treatment options can be specified according to downstream bonding, etching, forming, or other processing requirements.
Technical Specifications
| arameter | Standard ETP Grade | Oxygen-Free (OFE) Grade | Test Standard |
|---|
| Copper Content | ≥99.90% | ≥99.99% | ASTM B152 / JIS H3100 |
| Electrical Conductivity | ≥100% IACS | ≥101% IACS | ASTM B193 |
| Density | 8.94 g/cm³ | 8.94 g/cm³ | Archimedes Method |
| Surface Roughness (Rz) | 0.6–1.5 μm | 0.4–1.2 μm | ISO 4287 / JIS B0601 |
| Elongation at Break | 15–35% by temper | 18–40% by temper | IPC-TM-650 2.4.18 |
| Tensile Strength | 200–450 MPa by temper | 180–420 MPa by temper | IPC-TM-650 2.4.18 |
Available Thickness and Width
Thickness Range
9–70 μm
01
Standard Thicknesses
9 μm, 12 μm, 18 μm, 35 μm, 70 μm
02
Width Range
10–620 mm, slit to specification
03
Thickness Tolerance
±1.0 μm for thickness below 18 μm; ±5% for thickness ≥18 μm
04
Core Inner Diameters
76 mm (3 inch) and 152 mm (6 inch)
05
Temper and Surface Options
Soft Annealed (O)
The soft annealed temper provides higher elongation and lower tensile strength for applications requiring greater formability.
Half-Hard (H02)
H02 provides a balance between tensile strength and formability for general applications where both properties are important.
Full-Hard (H04)
H04 provides higher tensile strength for applications requiring greater dimensional stiffness.
Plain Surface
The plain option provides a rolled surface with anti-oxidation passivation.
Roughness-Enhanced Surface
A nodular surface treatment can be used when increased surface roughness and peel strength are required for bonding with PI or PET films.
Production Process
Cold Rolling
Multi-pass cold rolling reduces the copper foil to the required thickness under controlled rolling conditions.
Continuous Annealing
Controlled-atmosphere annealing adjusts the material structure and mechanical properties after rolling.
Surface Cleaning and Passivation
The foil is cleaned to remove processing residues and treated to improve surface protection.
Precision Slitting
The finished foil can be slit to the required width for downstream processing.

Inspection and Testing
CIVEN Metal's inspection process covers key material characteristics including:
• Thickness and width
• Tensile strength and elongation
• Surface condition
• Electrical conductivity
• Surface defects
• Roll and dimensional consistency
Material Test Reports can be supplied with the shipment according to the applicable order requirements.
Quality Certifications
- ISO 9001:2015 Quality Management System
- IATF 16949:2016 Automotive Quality Management System
- RoHS and REACH Compliance Reports supplied per batch.
Applications
Flexible Printed Circuits (FPC)
RA copper foil can be used in flexible circuit applications where repeated bending and mechanical flexibility are important.
01
Lithium-Ion Batteries
The foil can be considered for battery-related current-collecting and flexible electrical connection applications where the required material specification matches the design.
02
EMI Shielding
Copper foil can be used as a conductive layer for electromagnetic interference shielding in electronic equipment.
03
Precision Stamping
Different tempers allow the material to be selected according to the forming and mechanical requirements of precision electronic components.
04
Custom Slitting and Material Requirements
CIVEN Metal can provide slit widths and material configurations according to customer requirements.
When requesting a quotation, please provide:
• Required copper grade
• Thickness
• Width
• Temper
• Surface requirement
• Application
• Downstream processing method
• Required quantity
For trial production, sample or small-batch requirements can also be discussed with the sales team.
Packaging and Traceability
The foil is packaged to protect the roll, edges, surface, and core during transportation.
Each roll can be identified according to the applicable production and quality-control records to support product traceability.
Specific packaging, core, slitting, and shipping requirements can be confirmed before order placement.
Why Choose CIVEN Metal for Standard RA Copper Foil
Integrated Production Control
Cold rolling, annealing, surface processing, and slitting are coordinated within the production process.
Material Inspection
Key physical, mechanical, electrical, and dimensional properties are checked against the applicable product requirements.
Technical Transparency
Material and quality documentation can be provided for customers who need to verify material properties during incoming inspection or process validation.
Civen Metal Material (Shanghai) Co., Ltd. is one of the most professional standard ra copper foil manufacturers and suppliers in China. With abundant experience, we warmly welcome you to wholesale bulk high quality standard ra copper foil made in China here from our factory. Good service and reasonable price are available.
High precision RA Brass Foil, Tin Plated Copper Foil, Treated RA Copper Foil