Civen Metal Material (Shanghai) Co., Ltd. is one of the leading manufacturers and suppliers of single-side treated ra copper foil in China. Welcome to buy bulk durable single-side treated ra copper foil made in China here from our factory. If you have any enquiry about cooperation, please feel free to email us.
Single-Side Treated RA Copper Foil is designed with two different surface conditions: a micro-roughened treated side for dielectric bonding and an untreated smooth side for fine-line circuit processing.
The single-side electrochemical treatment creates mechanical anchoring points that improve copper-to-dielectric adhesion while leaving the opposite surface smooth. This surface configuration can help maintain etching performance where fine circuit patterns are required.
The copper foil is produced through precision rolling and continuous bright annealing. Its recrystallized equiaxed grain structure provides the dynamic flex endurance required for repeated bending applications.
The material is supplied in multiple thicknesses and can be slit to application-specific widths for flexible circuit, FCCL, shielding, and battery applications.
Key Material
Base Material: High-purity oxygen-free copper, including OFE / C10100 / C10200 grades, with copper purity of ≥99.99%.
Crystal Structure: Recrystallized equiaxed grain structure optimized through multi-stage cold rolling and continuous bright annealing.
Treatment Layer: Proprietary nodularized electrolytic treatment is applied exclusively to the treated side. An optional anti-corrosion barrier layer can also be applied to the matte side.
Purity Verification: The current product specification states that ultrasonic scanning and ICP-OES elemental analysis are used to verify material purity and inclusion control.
Performance Features
Single-Side Bonding Treatment
The treated surface provides mechanical anchoring points for dielectric materials while the opposite side remains untreated. Peel strength is specified at 0.8–1.4 kN/m on polyimide (PI) and PET substrates.
Dynamic Flex Endurance
The foil withstands more than 150,000 MIT folding cycles under the stated test condition of a 1 mm radius and 500 g load.
Controlled Thickness
Thickness tolerance is controlled within ±3% across the full coil width to reduce localized variation that could affect circuit processing and impedance consistency.
Thermal Resistance
The current specification states that the material withstands lamination temperatures up to 180°C without oxidation degradation.
For applications requiring treatment on both copper surfaces, Double-Side Treated RA Copper Foil provides a different bonding configuration.
Technical Specifications
| Parameter | Specification |
|---|---|
| Base Material | OFE / C10100 / C10200 oxygen-free copper |
| Copper Purity | ≥99.99% Cu |
| Nominal Thickness | 9 / 12 / 18 / 25 / 35 μm |
| Thickness Tolerance | ±3% across full coil width |
| Tensile Strength | 300–450 MPa |
| Elongation | 15–35% |
| Peel Strength | 0.8–1.4 kN/m on PI and PET |
| Surface Roughness, Treated Side | Rz 0.8–1.8 μm |
| Surface Roughness, Untreated Side | Ra ≤0.4 μm |
| Electrical Conductivity | ≥100% IACS |
| Standard Roll Width | 10–620 mm |
| Edge Burr | ≤3 μm |
| Core Inner Diameter | 3 inches (76 mm) or 6 inches (152 mm) |
Manufacturing & Quality Control
Precision Cold Rolling
Multi-high rolling mills are used to control foil thickness under closed-loop tension conditions, maintaining consistent gauge across the coil.
Bright Annealing
Continuous protective-atmosphere furnaces are used to relieve internal stress and stabilize the recrystallized copper structure and elongation characteristics.
Single-Side Treatment
Automated electrolytic deposition applies the micro-nodular treatment to one designated surface while keeping the opposing surface untreated and smooth.
Inspection
Finished material undergoes 100% automated optical inspection for pinholes, edge cracks, and surface scratches. Tensile, elongation, and peel-strength testing is performed by master-coil batch before final slitting.
Applications
Flexible Printed Circuits
The combination of one treated bonding surface and one smooth surface makes the foil suitable for FPC hinge zones, foldable smartphone circuits, notebook display hinges, and high-density camera module cables.
FCCL Manufacturing
The foil can be laminated with PI or PET films for single-sided or double-sided flexible copper-clad laminate structures.
EMI Shielding
The conductive copper surface can be used in conductive tapes and EMI shielding gaskets for high-frequency telecommunications equipment.
Battery Current Collectors
The foil can be used for specialized flexible tabs in lithium-ion pouch cells where the interconnection is exposed to continuous vibration and repeated mechanical stress.
Customization & Supply Options
The product can be supplied with customized dimensions and surface-treatment conditions according to the requirements of the customer's processing system.
Thickness: 9 / 12 / 18 / 25 / 35 μm standard options
Slitting Width: Down to 10 mm
Edge Burr: ≤3 μm
Surface Treatment: Treated-side Rz can be adjusted according to the adhesive system
Adhesive Compatibility: Epoxy, acrylic, and modified polyimide systems
Core Inner Diameter: 3 inches (76 mm) or 6 inches (152 mm)
Trial Rolls: 50–100 m
The treated-side roughness can be tuned according to customer adhesive chemistry and lamination requirements.
Packaging & Delivery
Each coil is supplied in a suspended wooden crate. The material is passivated and vacuum-sealed in an anti-static aluminum foil bag with active desiccant to reduce exposure to moisture and oxidation during transportation.
Laser-etched identification numbers on the inner core provide traceability for the melt number, master coil ID, production date, and thickness profile.
Standard stock specifications: 2–3 weeks.
Custom slit widths or specialized surface treatments: 4–6 weeks.
FAQ
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