Civen Metal Material (Shanghai) Co., Ltd. is one of the leading manufacturers and suppliers of high-temperature treated ra copper foil in China. Welcome to buy bulk durable high-temperature treated ra copper foil made in China here from our factory. If you have any enquiry about cooperation, please feel free to email us.
CIVEN Metal High-Temperature Treated RA Copper Foil is engineered for electronic substrates requiring high thermal stability and mechanical endurance. Precision cold rolling combined with controlled hydrogen-nitrogen thermal treatment optimizes grain structures to resist recrystallization and softening during high-temperature manufacturing. An applied anti-oxidation passivation layer prevents copper oxide scaling during multi-layer board (MLB) lamination and flexible printed circuit (FPC) coverlay bonding.
Key Material
Base Material: High-purity cathode copper (>= 99.99% Cu-ETP / Cu-OF).
Microstructure: Uniform equiaxed grain distribution formed via multi-pass cold rolling and controlled atmosphere annealing.
Surface Treatment: Proprietary anti-oxidation passivation barrier with optional mechanical/chemical roughening to maximize peel strength against polyimide (PI) or liquid crystal polymer (LCP) films.
Performance Features
Thermal Resistance: Resists oxidation and retains mechanical integrity up to 300°C for 60 minutes without surface discoloration.
Flexural Endurance: Equiaxed crystal orientation provides dynamic bending fatigue life exceeding 150,000 MIT folding cycles at 18 um thickness.
Peel Strength: Maintains stable peel strength (>= 0.8 kN/m) with PI substrates after multiple lead-free reflow cycles (260°C).
Dimensional Stability: Controlled residual stress profile eliminates curling or wrinkling during chemical etching.
Technical Specifications
|
Parameter |
Specification Range |
Test Standard |
|
Purity |
>= 99.99% Cu |
ICP-OES |
|
Thickness |
12 um, 18 um, 25 um, 35 um (+/- 5%) |
Beta-ray gauge |
|
Surface Roughness (Rz) |
0.8 um - 2.5 um (Matte / Shiny options) |
JIS B 0601 / ISO 4287 |
|
Tensile Strength |
350 - 450 MPa (Room temperature) |
IPC-TM-650 2.4.18 |
|
Elongation |
>= 15% |
IPC-TM-650 2.4.18 |
|
High-Temp Oxidation Resistance |
No surface discoloration at 250°C for 30 min |
SEM / Visual |
|
Electrical Conductivity |
>= 98% IACS |
ASTM B193 |
Manufacturing & Quality Control
Rolling: High-precision Sendzimir mills maintain thickness uniformity within +/- 3 um across coil widths.
Annealing: Continuous bright annealing lines operate under strict hydrogen-nitrogen protective atmospheres.
Inspection: 100% Automated Optical Inspection (AOI) scans for pinholes, metallic inclusions, and edge cracks.
Laboratory Verification: Lots undergo tensile testing, surface profiling, and glow discharge mass spectrometry (GD-MS) purity analysis.
Applications
Flexible Printed Circuits (FPCs): Dynamic hinge circuits in foldable displays and medical probes.
Electric Vehicles (EVs): Battery Management System (BMS) flexible flat cables and laminated busbars.
High-Frequency Transmission: 5G antenna modules and millimeter-wave communication substrates.
Semiconductor Packaging: Chip-on-Flex (COF) substrates requiring fine-line etching (<= 15 um line/space).
Customization & OEM Supply
Width Range
10 mm to 620 mm slit widths.
Core Diameters
3-inch (76 mm) and 6-inch (152 mm) industrial cores.
Adhesion Coatings
Customized for specific dielectric resins (PI, PET, PTFE, LCP).
Sample Program
A4 sheet samples and 50 m trial slit coils available.
Packaging & Delivery
Packaging Configuration: Anti-static vacuum-sealed polyethylene bags, silica gel desiccant, suspended foam end-caps, and fumigation-free wooden export crates.
Storage Environment: Temperature-controlled (20°C +/- 5°C, relative humidity < 60%) away from corrosive chemical fumes.
Lead Time: Stock specifications ship in 7–10 business days; custom production runs require 20–25 business days.
Why CIVEN Metal
Direct Mill Integration: In-house processing from raw copper melting to final slitting ensures complete lot traceability.
Metallurgical Specialization: Dedicated R&D focused on grain boundary engineering and surface passivation chemistry.
Export Infrastructure: Compliant packaging and established logistics routes to North America, Europe, and Asia.
FAQ
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